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The New Photonic Computing Paradigm

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Optical Multiply Accumulate

  • Based on a silicon photonics platform compatible with CMOS processes, optical-electrical co-design, and advanced packaging solutions 

  • Novel design using high speed, configurable, compact modulators

  • Unique computing architecture: coherent and incoherent architectures

  • Hardware-algorithm co-optimization

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CMOS-compatible silicon photonic process platform, photo-electric co-design, advanced packaging

High-speed compact and configuarable photo-electric modulator

Novel computer architecture, MZI-based interfering/non-interfering solutions

Hardware-software co-optimization


Superior energy efficiency

Ultra-low latency

Strong parallel computing capabilities

Lesser requirement on process node and lower manufacturing cost


Optical Network on Chip

Data is transmitted in the optical chip network

  • Accelerates data transmission within a single electronic chip (EIC)

  • Accelerates data communication between multiple electronic chips (EIC) within a single package unit

  • Energy efficiency ratio is as low as < 1pJ/bit, which is 1/6 of eNOC

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Construction of a communication network topology, connecting single or multiple electrical chips (EIC) via nodes on photonic chip (PIC), enabling high speed data interconnect based on oNOC

Novel network topology based on optical broadcasting and wavelength division multiplexing


High bandwidth, low energy consumption, low latency, distance-independent

Strong versatility, providing high-speed interconnect among different types of electronic chips

Wide applications in bandwidth-constrained user cases


Optical Networking

Photonic chip integrated with optical BUS, which collects data within one package unit and interacts with other package units through light propagation medium

  • oNET bandwidth is orders of magnitude greater than eNET

  • oNET energy consumption ~2pJ/bit, which is 1/4 of NVLink3.0

  • oNET latency ~3.5ns, which is 1/3 of NVLink3.0

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PIC-EIC co-package, PIC with transceiver sends / receives signal and performs electrical-optical / optical-electrical conversion

When sending, data flows from EIC → PIC → External

When receiving, data flows from External → PIC → EIC


High energy efficiency, low optical propagation loss

High bandwidth, low latency


Technology File

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